Electronics ProductsHeat Resistance Polyimide Tape
Polyimide masking tape with silicone-free adhesive material.
TOMOEGAWA's Heat Resistance Polyimide Tape is a masking film using our proprietary developed adhesive material.
The Polyimide tape strongly adheres under the process. After the process is completed, the tape can be easily removed without any glue residue.
Since the tape does not contain silicone, there is no contamination or issue due to siloxane gas.
The tape should meet the following needs.
We also get good appraisal by customer for our quality management system.
Feature 1High heat resistance without silicone by our proprietary developed process.
Generally speaking, heat resistance masking tapes are composed of silicone base adhesive material which have a severe risk to contaminate other materials due to siloxane gas.
Since TOMOEGAWA's Heat Resistance Polyimide Tape does not contain silicone base adhesive material, the tape is safely used for applications which need to be silicone-free.Furthermore, the tape has high heat resistance which is suitable for masking, thermal spraying, etc.
Feature 2It's possible to adjust alignment precisely.
TOMOEGAWA's heat resistance making tape is composed of thermo-setting adhesive material which has no tackiness under room temperature.
Therefore, it's easy to adjust alignment precisely.
Data
| Characteristic item | Specification |
|---|---|
| Polyimide Film(Base film)Thickness(μm) | 25～ |
| Thickness(μm) | 5 |
| Initial adhesion strength(gf/50mm) | 50 |
| Tackiness under room temp. | None |
| Storage | Room temperature |
| Application temp | 80～120℃ |
Application
- Resin encapsulation of QFN, discrete, LED packages etc.
- Masking (plating, soldering, thermal spraying, etc.)
- Masking in high temperature environment
- Heat resistance carrier tape
Layer Structure
※Thickness of adhesive layer and cover film is adjustable.
