We exhibited at "Automotive Engineering Exposition 2025 YOKOHAMA", from May.21 (Wed) to 23 (Fri), 2025.

We introduced products creating new business value, including our mainly showcased cellulose fiber compounded resin 'GREEN CHIP CMF', as well as Thermal Barrier / Flame Spread Prevention Sheet, Thermo-setting Electrical Insulation Film SJ41 that can be provided in thin films (5μm~), and Sealing Tape HT56 for Insert Molding.
We would like to express our sincere gratitude to everyone who visited our booth.

We would also like to thank the many visitors to our online exhibition.

At this exhibition, we were delighted to welcome more visitors than expected, giving us the chance to showcase our products to a wide audience.
Our 'GREEN CHIP CMF' was especially well-received, as we clearly demonstrated its design and functionality with molded samples. Our Thermal Barrier Sheet also attracted strong interest from the automotive industry, with many detailed inquiries regarding thickness, fire resistance, and insulation performance.

In addition to the products and technologies exhibited, we will also make full use of our formulation development, evaluation, and processing technologies to meet the various needs of our customers through co-creation. We also offer services for customers’ initial development projects and exploration of new processes.
We look forward to your continued support in the future.

We are also planning to exhibit at the "Automotive Engineering Exposition 2025 NAGOYA" (venue: AICHI SKY EXPO) to be held from July 16th to 18th.
We look forward to welcoming you at our booth.