TechnologyAnalysis / evaluation
We support product development and quality maintenance by making full use of various analysis technologies
In order to support product development, process inspection, and quality assurance of our wide range of product group, we are evolving not only paper, but also resin, rubber, and toxic substances analysis technologies. Tomoegawa Analysis Center is actively engaged in outsourcing to help our customers.
Tomoegawa Analysis Center

Tomoegawa Analysis Center is the analysis department of the Tomoegawa Paper, which has been in business for over 100 years.
We analyze not only paper, magnetism, powder and electronic materials, but also the "iCas" field, which is a heat, electric and magnetic wave control material. We also accumulate and study these technologies.
Tomoegawa Analysis Center website(Japanese version only)
Tomoegawa Analysis Center Main evaluation equipment and measurement examples

We consult with our customers and propose appropriate analysis designs by combining various evaluation devices and the requested measurement and analysis.
Observe

We observe the laminated form and minute contaminants by making full use of optical microscope, electron microscope, etc. In particular, our unique section processing technology can provide images that are both speedy and faithful to the real sample.
Analysis type | Device name | Measurement content |
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Observation / inorganic component analysis | FIB processing equipment (Focused Ion Beam and Scanning Ion Microscope) | Micro region processing and observation |
FE / SEM-EDS · WDS (FE type Scanning Electron Microscope) | Micro area observation | |
W / SEM-EDS (Tungsten type Scanning Electron Microscope) | Micro area observation | |
Laser microscope | Observation surface shape / roughness analysis | |
SPM (Scanning Probe Microscope) | Micro area observation (surface area and surface roughness) | |
Digital microscope | Surface observation | |
Optical microscope | Surface observation | |
CP (ion polisher) | Micro field processing device | |
Cryo CP (cooling ion polisher) | Micro field processing device | |
Diamond wire saw | Micro field processing device | |
Ultra microtome | Micro field processing device | |
Semi-automatic grinding device | Micro field processing device |
Investigate

We can analyze both inorganic and organic substances, and we provide accurate analysis results based on our abundant experience. Pyrolysis-GC / MS can pyrolysis products and characterize polymers.
Analysis type | Device name | Measurement content |
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Organic composition and ingredient analysis | FT-IR (Fourier Transform-Infrared Spectroscopy) | Component analysis |
Time Based FT-IR (ATR) | Component change analysis during heating | |
Microscopic Raman spectorometer | Component analysis | |
GC -FID (gas Chromatograph-Flame Ionization Detector) |
Component analysis | |
HS-GC / MS(Head Space-Gas Chromatograph Mass Spectrometer) | Component analysis | |
TDS-GC / MS (Thermal Desorption Gas Chromatograph-Mass Spectrometer) | Component analysis | |
Py-GC/MS (Pyrolysis Gas Chromatograph) | Component analysis | |
HPLC (High Performance Liquid Chromatograph) | Component analysis | |
LC-MS / MS (Liquid Chromatograph -Tandem Mass Spectrometry) | Component analysis | |
GPC (Gel-Permeation Chromatography) | Molecular weight distribution measurement | |
Karl Fisher Moisture meter | Moisture content | |
High-precision gas / vapor adsorption measurement instrument | Specific surface area / pore distribution (nm) / measurement adsorption amounts | |
Potentiometric Titrator | Titration analysis | |
Inorganic composition and structure analysis | XPS (X-ray photoelectron spectroscopy)[with C60, Ar sputter] | Top surface element analysis device |
ICP-MS (Inductively-Coupled Plasma- Mass Spectrometer) | Elemental analysis | |
ICP-OES (Inductively-Coupled Plasma-Optical Emission Spectrometer) | Elemental analysis | |
Microwave digestion system | Pretreatment device | |
XRD (X-Ray Diffractometer) | Crystal / structure analysis | |
XRF (X-Ray Fluorescence) | Elemental analysis | |
Impurity ion analysis | Oxygen combustion in closed systems | Pretreatment device |
IC(Ion Chromatograph) | Ion component measurement | |
PH meter | PH determination | |
Electric conductivity meter | Electrical conductivity measurement |
Taking measurement

Physical properties such as mechanical, heat, and electricity can be measured. High frequency [18-110 GHz] permittivity and permeability can also be measured.
Analysis type | Device name | Measurement content |
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Thermal analysis | TG / DTA (thermogravimetric / differential thermal analysis) | Thermal weight loss measurement |
DSC (differential travel calorimeter) |
Calorific value change measurement (melting, glass transition, thermal history, crystallization, hardening) |
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Modulated DSC |
Calorific value change measurement (melting, glass transition, thermal history, crystallization, hardening) |
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Mechanical property analysis | Tensilon (universal tensile tester) | Tensile test |
TMA (thermomechanical analysis) | CTE measurement | |
Rockwell hardness tester | Hardness determination | |
DMA (Dynamic Compression Rate Measuring Device) | Determination of heating rate | |
Dispersion measurement | Zeta potential measuring machine | Zeta potential measurement (dispersion / aggregation of particles) |
Measurement of electrical conductivity and permeability | Permittivity / permeability measuring device (free space method: 18G-110Ghz) | Measurement of electrical conductivity and permeability |
Permittivity / permeability measuring device (inductance method: 1M to 1GHZ) | Measurement of electrical conductivity and permeability | |
Permittivity / permeability measuring device (parallel plate method: 1M-1GHz) | Measurement of electrical conductivity and permeability | |
Permittivity / permeability measuring device (cavity resonance method: 1G, 2G, 10G, 20GHz) | Measurement of electrical conductivity and permeability | |
Apparatus for measuring electrical conductivity and permeability (KEC method: 1M to 1GHz) | Measurement of electrical conductivity and permeability |