Electronics related productsRemovable High-thermal Electrical Insulating Adhesive Tape iCas F-TR
Can be used in high temperature environments up to 350℃ Suitable for temporary fixing in electronic parts manufacturing process
Easy-peel adhesive tape iCas F-TR is a temporary fixing tape with excellent heat resistance high temperatures up to 350℃.
Suitable for temporary fixing applications in the manufacturing process of electronic components such as semiconductors.
It can be attached to the object surface at room temperature, and after heat treatment, there is no resin residue left and it can be removed from the adhered surface.
It support reflow process, plasma and flux cleaning, etc.
features 1High heat resistance and easy peeling
iCas F-TR has the unique property that the adhesion is temporarily improved by heating, and then further heating reduces the adhesion.
Therefore, it adheres closely to the adhered surface even in a high temperature environment, and can be easily peeled off without leaving any residue after the process is complete.
In addition, since there is no need for additional processes such as heating and UV irradiation during peeling, it is a solution that contributes to improved work efficiency.
features 2Excellent chemical resistance
It can be applied to various chemicals such as toluene, THF, and IPA.
【Chemical immersion test result】
After soaking in the prescribed chemical for 30 minutes, obserbation of the appearance change as below
| Toluene | THF | IPA | 10% KOH aqueous solution | 5% HCl aqueous solution | |
|---|---|---|---|---|---|
| Appearance | No change | No change | No change | No change | No change |
| Removing property | No change | No change | No change | No change | No change |
features 3PFAS (fluorine compound)-free formulation design
PFAS (fluorine compounds) have been pointed out to be persistent and harmful to the environment and human body, and regulations are being tightened worldwide.
There is also a growing demand for PFAS-free products in the manufacturing process of electronic parts.
iCas F-TR is not affected by PFAS regulation due to formulation design that does not use PFAS.
Technical data
| Characteristic item | Specification | Remarks |
|---|---|---|
| Standard adhesive thickness (μm) | 5 | |
| Initial adhesion (N/25 mm) | 2.3 | Attachment: PPF plated copper plate |
| Tackiness at room temperature | Yes | |
| Storage environment | Room temperature | |
| Application temperature | Room temperature to 120°C |
Application
- For Components carrier tape in the manufacturing process
- Temporary fixing of the back of silicon, glass, and Alumina substrate such as FO-WLP(with high temperature rewiring layer) in the semiconductor packaging process
- Masking in high temperature environment (plating, soldering, thermal spraying, etc.)
- Prevent Prevention of resin bleed in lead frame package
Examples of Applicable Materials
Copper, gold, Alumina, silicon, etc.
Layer Structure
※The thickness of the adhesive film and polyimide film can be adjusted.
