Electronics ProductsAdhesive Tape for QFN
Hybrid adhesive tape contributes to higher density and smaller size of electronic devices
Adhesive tape to prevent resin leakage is required when assembling a small package such as QFN（Quad Flat Non-lead）package during the molding process.
We supply it to customers under the name "Elephane A-T5", which is a combination of heat-resistant film and adhesive.
Feature 1No mold bleed
- It has a stable adhesion at high temperature.
Feature 2No tape residue
- The adhesive is with heat resistance and plasma resistance.
Feature 3Good W/B workability
- The adhesive is with high elastic and non-silicon.
- It is used for QFN, discrete, LED package etc. assembly.