Hybrid adhesive tape contributes to higher density and smaller size of electronic devices

Adhesive tape to prevent resin leakage is required when assembling a small package such as QFN（Quad Flat Non-lead）package during the molding process.

We supply it to customers under the name "Elephane A-T5", which is a combination of heat-resistant film and adhesive.

Feature 1No mold bleed

• It has a stable adhesion at high temperature.

Feature 2No tape residue

• The adhesive is with heat resistance and plasma resistance.

Feature 3Good W/B workability

• The adhesive is with high elastic and non-silicon.

Application

• It is used for QFN, discrete, LED package etc. assembly.