Electronics-related productsAdhesive Tape for QFN
Adhesive tape for QFN packages prevents resin bleed during molding process
When manufacturing QFN (Quad Flat Non-lead) ,etc by MAP molding process, resin leakage may occur during the molding process.
Tomoegawa’s Adhesive tape for QFN packages is attached as back side tape on the rear side of the lead frame to prevent resin bleeding.
By combining a highly heat resistance-resistant film with a specialized adhesive, these products provide excellent mold bleeding prevention performance for both Cu/Ag spot and PPF lead frames.
Furthermore, taping is possible at a low temperature of 80–120°C, which also helps suppress warpage of the lead frame after taping.
We offer a range of products tailored to your processes, including types suitable for Cu wire bonding and types compatible with reflow processes at high temperatures.
Technical data
| Product ID | A-T5 | A-TC7 series | A-TC7H series | A-TR |
|---|---|---|---|---|
| features | Standard grade | High modulus Compatible with Au and Cu wire |
High modulus Compatible with Au and Cu wire Low-temperature attachment |
Reflow process and Compatible with Cu clip bonding |
| Taping temperature | 80–100°C Press / Lamination |
100–120°C Press |
80–100°C Press / Lamination |
Room temperature lamination |
| Tape peeling temperature | Room temperature | Room temperature - 200℃ | Room temperature - 200℃ | Room temperature |
| Resin bleeding prevention properties | ◎ | ◎ | ◎ | ◎ |
| Residues after plasma treatment | ○ | ◎ | ◎ | ◎ |
| Wire bonding suitability | ○ | ◎ | ◎ | - |
| Resistance to reflow processes (up to 350°C) | - | - | - | ◎ |
◎Excellent 〇Very good
Application
- MAP molding process for QFN, discrete devices, LED packages, etc
Layer Structure
