We exhibited at “SEMICON Japan 2025”, from December 17th (Wednesday) to December 19th (Friday), 2025.

At SEMICON Japan 2025, we were pleased to welcome many visitors to our booth and have the opportunity to showcase our products.
In particular, the "350°C Heat-resistant Removable Adhesive Tape iCas F-TR" received numerous inquiries about its application in high-temperature processes, along with requests for samples and technical evaluations.

We also received detailed inquiries from equipment and component manufacturers, regarding temperature requirements and design considerations for our insulation sheets and thin-layer heaters.
These exchanges provided valuable insights for future product development and application studies.
Moving forward, we will continue to respond to our customers’ needs and contribute to the advancement of the semiconductor industry by providing even higher-performance products.