We exhibited at “Automotive Engineering Exposition 2026 YOKOHAMA", held from May 27 (Wed) to 29 (Fri), 2026, and at "Automotive Engineering Exposition 2026 NAGOYA", held from June 17 (Wed) to 19 (Fri), 2026.

We would also like to thank the many visitors who accessed our online exhibition during the same period.

We introduced products creating new business value, including our mainly showcased cellulose fiber compounded resin "GREEN CHIP CMF", as well as Thermal Barrier / Flame Spread Prevention Sheet, Multi-material Adhesive Tape (Corrosion Prevention Type), which enables adhesion between multi-materials by heating and compression while mitigating galvanic corrosion, and HT56 sealing tape for insert molding.
We would like to express our sincere gratitude to everyone who visited our booth.

We were delighted to welcome more visitors than expected and to showcase our products to a broad range of industry professionals.​
In particular, our GREEN CHIP CMF molded products were handled directly by visitors and received highly favorable evaluations not only for their design and functionality, but also for their texture and pleasant feel.​
We also received many specific inquiries and requests regarding our Thermal Barrier / Flame Spread Prevention Sheets and electronic materials tape products.

In addition to the products and technologies exhibited, we will continue to leverage our formulation development, evaluation, and processing technologies to meet the various needs of our customers through co-creation. We also provide support for customers in the early stages of development and in exploring new processes.
We sincerely appreciate your continued support.